In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. However, in order to perform reliably, the board must be well-manufactured. High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. Proc SPIE, 2015: 9422, Badr Y, Torres A, Gupta P. Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias. DOPPLER: DPL-aware and OPC-friendly gridless detailed routing with mask density balancing. Standard cell layout regularity and pin access optimization considering middle-of-line. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. 139–140, Zou J B, Wang R S, Luo M L, et al. 1–6, Realov S, Shepard K L. Analysis of random telegraph noise in 45-nm CMOS using on-chip characterization system. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Salt Lake City, 2012. Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications. Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. In addition, predictable development time, efficient manufacturing with high yields, and exemplary Here, the DFM methodology includes a set of techniques to modify the design of integrated circuits (IC) in order to make them more manufacturable, i.e., to improve their functional yield, parametric yield, or their reliability. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. A unified perspective of RTN and BTI. A unified approach for trap-aware device/circuit co-design in nanoscale CMOS technology. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 27–34, Chen T C, Cho M, Pan D Z, et al. Double patterning lithography friendly detailed routing with redundant via consideration. Graphoepitaxy of self-assembled block copolymers on two-dimensional periodic patterned templates. A fuzzy-matching model with grid reduction for lithography hotspot detection. 178–185, Tian H T, Zhang H B, Xiao Z G, et al. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. Self-aligned double patterning decomposition for overlay minimization and hot spot detection. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. Engineers often talk about the importance of design for reliability (DfR) and the impact it has on a product’s overall efficiencies and success. 28: 6, Yang J-S and Pan D Z. Overlay aware interconnect and timing variation modeling for double patterning technology. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. 453–460, Ye W, Yu B, Ban Y-C, et al. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. IEEE Trans Electron Dev, 2011, 58: 3652–3666, Wang R S, Huang R, Kim D-W, et al. Proc SPIE, 2003, 5256, Roseboom E, Rossman M, Chang F-C, et al. Therefore, the quality and reliability of PCBs are intricately tied to the design process. Subscribe to DesignWare Technical Bulletin. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Effective product development must go beyond the traditional steps of acquiring and implementing product and process design technology as the solution. 289–294, Xu X Q, Cline B, Yeric G, et al. Metal-density-driven placement for CMP variation and routability. Proc SPIE, 2015: 9427, Chava B, Rio D, Sherazi Y, et al. As an FDA-regulated medical technology company making devices for direct consumer use, our product had some unique challenges in regard to reliability, manufacturability, and cost. 502–507, Cho H, Cher C-Y, Shepherd T, et al. It also introduces a DFM/A assessment methodology that can be subsequently used within your organization to … FinFET Design, Manufacturability, and Reliability. The most accepted lead-free alternatives present, for example, higher melting temperatures compared with the typically used Sn–Pb eutectic solder, which can affect both the manufacturability and reliability of lead-free electronics. 1–7, Zhang H B, Du Y L, Wong M D, et al. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. CSL: coordinated and scalable logic synthesis techniques for effective NBTI reduction. Accurate lithography hotspot detection based on principal component analysis-support vector machine classifier with hierarchical data clustering. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 460–470, Yu B, Gao J-R, Ding D, et al. Proc SPIE, 2010: 7823, Elayat A, Lin T, Sahouria E, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. Characterization and decomposition of self-aligned quadruple patterning friendly layout. 219–222, Drmanac D G, Liu F, Wang L-C. Triple patterning lithography aware optimization for standard cell based design. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. Machine-learning-based hotspot detection using topological classification and critical feature extraction. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2011. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 699–712, Hu S Y, Hu J. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. Mask strategy and layout decomposition for self-aligned quadruple patterning. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. J Micro/Nanolithogr MEMS MOEMS, 2015, 14: 011003, Matsunawa T, Gao J-R, Yu B, et al. Pattern split rules! Optimally minimizing overlay violation in self-aligned double patterning decomposition for row-based standard cell layout in polynomial time. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), San Jose, 2007. Soft-error-tolerant design methodology for balancing performance, power, and reliability. An interconnect reliability-driven routing technique for electromigration failure avoidance. Design for Manufacturability (DfM) Seminar. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2014. Directed self-assembly based cut mask optimization for unidirectional design. Proc SPIE, 2013: 8684, Ma Y S, Torres J A, Fenger G, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. 61–68, Oboril F, Tahoori M B. ExtraTime: modeling and analysis of wearout due to transistor aging at microarchitecturelevel. 389–391, Ebrahimi M, Oboril F, Kiamehr S, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. What Are The Benefits Of Design For Manufacturability. ACM Trans Des Automat Electron Syst, 1996, 1: 371–395, Yu B, Gao J-R, Pan D Z. L-Shape based layout fracturing for E-Beam lithography. J Electrochem Soc, 2005, 152: G45–G49, De Orio R L, Ceric H, Selberherr S. Physically based models of electromigration: from Black’s equation to modern TCAD models. 398–403, Lin Y-H, Ban Y-C, Pan D Z, et al. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. Fast dual graph based hotspot detection. 123–129, Hsu P-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on conflict graph pre-coloring. 283–289, Ma Q, Zhang H B, Wong M D F. Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology. 544–549, Posser G, Mishra V, Jain O, et al. 33.5.1–33.5.4, Roy S, Pan D Z. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 726–739, Chien H-A, Chen Y-H, Han S-Y, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 390–395, Liu Z Q, Liu C W, Young E F Y. Correspondence to One of the biggest factors is the manufacturability … In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), San Jose, 2010. Proc SPIE, 2013: 8684, Tian H T, Du Y L, Zhang H B, et al. 71–76, Ban Y, Lucas K, Pan D Z. 325–332, Chen X D, Liao C, Wei T Q, et al. Meeting the stringent requirements using low-tolerance components and cost constraints demanded of mobile wireless and handset components has required a laser-like focus on long term reliability and design-for-manufacturability (DFM). In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 545–550, Ding D, Torres J A, Pan D Z. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. It is therefore critical that companies have a design for manufacturability (DfM) protocol in place to mitigate these problems. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. The difference between the best thermally optimal design and the best manufacturable design represents the “manufacturability gap” [4, 5]. TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. © 2020 Springer Nature Switzerland AG. Automated full-chip hotspot detection and removal flow for interconnect layers of cell-based designs. MOS device aging analysis with HSPICE and CustomSim. 506–511, Yuan K, Lu K, and Pan D Z. 161: 6, Ebrahimi M, Liang C, Asadi H, et al. Proc SPIE, 1995, 2438: 2–17, Article  IEEE Trans Comput Aided Des Integr Circ Syst, 2011, 30: 1621–1634, Wuu J-Y, Pikus F-G, Torres A, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. 208–213, Chien H-A, Han S-Y, Chen Y-H, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2006. TRIAD: a triple patterning lithography aware detailed router. Proc SPIE, 2006, 6349, Yao H, Sinha S, Chiang C, et al. Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Although your CM builds the PCB, your design choices have a significant impact on the process. 838–842, Ryzhenko N, Burns S. Physical synthesis onto a layout fabric with regular diffusion and polysilicon geometries. An effective triple patterning aware grid-based detailed routing approach. What is Design for Reliability (DfR)? In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2007. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2012. Design for Manufacturability The success of a product’s development and production begins with the design. 32–39, Zhang H B, Du Y L, Wong M D F, et al. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. 25: 6, Cho M, Ban Y, Pan D Z. Yu, B., Xu, X., Roy, S. et al. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. In addition, predictable development time, efficient manufacturing with high yields, and exemplary Designing RF-MEMS has not been without its challenges. Rapid layout pattern classification. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. 38–43, Chakraborty A, Pan D Z. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 433–446, Yu B, Yuan K, Zhang B Y, et al. All components have some tolerance ratings; these are usually specified as absolute percentages, or as deviations from a nominal value. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 1628–1639, Sheng W G, Xiao L Y, Mao Z G. Soft error optimization of standard cell circuits based on gate sizing and multiobjective genetic algorithm. 69: 6, Zhang Y, Luk W-S, Zhou H, et al. DFM Design for Manufacturability Valor Trilogy Valor NPI service 24 to 48 hours turn component coverage limited to current Valor library (30+ million parts) footprint design reduce assembly rework and enhances long term reliability DFM&R75 249–255, Shim S, Chung W, Shin Y. Proc SPIE, 2015: 9427, Xu X Q, Cline B, Yeric G, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. 116–123, Kuang J, Chow W-K, Young E F Y. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 601–606, Xu Y, Chu C. A matching based decomposer for double patterning lithography. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Design for Reliability is a very hot topic these days, and it can be a challenge to find a good starting point that will give you the foundation you need to start sifting through and exploring all of the available options. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Efficient process-hotspot detection using range pattern matching. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2007. Mentor Graphics White Paper, 2013, Selim M. Circuit aging tools and reliability verification. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. A cost-driven fracture heuristics to minimize sliver length. New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate technology for the nano-reliability era. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. PBTI-associated high-temperature hot carrier degradation of nMOSFETs with metal-gate/high-k dielectrics. Science China Information Sciences An efficient layout decomposition approach for triple patterning lithography. In: Proceedings of International Conference on VLSI Design, Mumbai, 2014. In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. Methodology for standard cell compliance and detailed placement for triple patterning lithography. 127–133, Roy S. Logic and Clock Network Optimization in Nanometer VLSI Circuits. Proc SPIE, 2007, 6521, Kahng A B, Park C-H, Xu X. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. volume 59, Article number: 061406 (2016) What Are The Benefits Of Design For Manufacturability. Machine learning based lithographic hotspot detection with critical-feature extraction and classification. Design For Reliability Manufacturability Handbook full free pdf books Formulating the electrical behavior of a design in terms of probability distributions on its tolerances is a … Part of Springer Nature. Cite this article. High performance lithography hotspot detection with successively refined pattern identifications and machine learning. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. EPIC: efficient prediction of IC manufacturing hotspots with a unified meta-classification formulation. By Jamil Kawa, R&D Group Director, Synopsys, Inc. Introduction. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. Proc SPIE, 2013: 8880, Ou J J, Yu B, Gao J-R, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2012. 410–417, Mallik A, Ryckaert J, Mercha A, et al. In: Proceedings of IEEE International Conference on Computer Design (ICCD), New York, 2015. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. Double patterning lithography aware gridless detailed routing with innovative conflict graph. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. Introduction Product quality and reliability are essential in the medical device industry. Proc SPIE, 2012: 8323, Du Y L, Guo D F, Wong M D F, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 19.5.1–19.5.4, Ren P P, Wang R S, Ji Z G, et al. SAMURAI: an accurate method for modelling and simulating nonstationary random telegraph noise in SRAMs. Multi-patterning lithography aware cell placement in integrated circuit design, 2013. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. Synopsys White Paper, 2011, RedHawk-SEM. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Stitch aware detailed placement for multiple e-beam lithography. Proc SPIE, 2015: 9427, Mirsaeedi M, Torres J A, Anis M. Self-aligned double-patterning (SADP) friendly detailed routing. 33–40, Pak J, Yu B, Pan D Z. Electromigration-aware redundant via insertion. Design for Manufacturability with Advanced Lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. Structural dmr: a technique for implementation of soft-error-tolerant fir filters. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. There are many factors influencing the product design resulting in a profitable business. 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. 65–66, Bita I, Yang J K W, Jung Y S, et al. Assessment and comparison of different approaches for mask write time reduction. Concept of reliability engineering 53: 6, Fang S-Y, Chang Y-W, and Chen W-Y. To address this need, ReliaSoft offers a three-day training seminar on Design for Reliability … In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 419–432, Hougardy S, Nieberg T, Schneider J. BonnCell: automatic layout of leaf cells. The conventional reliability aware … Layout decomposition for quadruple patterning lithography and beyond. 63–66, Lin Y-H, Li Y-L. On refining row-based detailed placement for triple patterning lithography. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. However, in order to perform reliably, the board must be well-manufactured. Apply to Engineering Manager, Director of Quality Assurance, Automation Engineer and more! Parts are designed for ease of … Layout decomposition approaches for double patterning lithography. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. New observations on AC NBTI induced dynamic variability in scaled high-κ/metal-gate MOSFETs: characterization, origin of frequency dependence, and impacts on circuits. 75–80, Lin C-H, Roy S, Wang C-Y, et al. In the past, products have been designed that could not be produced. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 59, 061406 (2016). A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. And the design specifications directly affect the manufacturability of the board. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. 75–80, Yu B, Xu X Q, Ga J-R, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 778–793, Lin Y B, Yu B, Xu B Y, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2011. Design for Manufacturability (DFM) is a system approach that simultaneously considers all of the design goals and constraints for products that will be manufactured. Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. Springer, 2014, Maricau E, Gielen G. Computer-aided analog circuit design for reliability in nanometer CMOS. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. 17–24, Xiao Z G, Du Y L, Tian H T, et al. Modeling and minimization of PMOS NBTI effect for robust nanometer design. 396–403, Yu B, Xu X Q, Gao J-R, et al. 954–957, Zhang H B, Wong M D F, Chao K Y. Self-aligned double patterning aware pin access and standard cell layout cooptimization. Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. 601–607, Chou H-M, Hsiao M-Y, Chen Y-C, et al. US Patent 8-495-548, Gao J-R, Yu B, Huang R, et al. IEEE Trans Electron Dev, 2013, 60: 1716–1722, Grasser T, Kaczer B, Goes W, et al. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 186–193, Xiao Z G, Du Y L, Wong M D F, et al. 637–644, Yu B, Yuan K, Ding D, et al. Triple patterning aware detailed placement with constrained pattern assignment. Self-aligned double patterning friendly configuration for standard cell library considering placement. https://doi.org/10.1007/s11432-016-5560-6, DOI: https://doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips, Not logged in Predicting variability in nanoscale lithography processes. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Macao, 2016. Proc SPIE, 2005, 5751, Kahng A B, Xu X, Zelikovsky A. Yield-and cost-driven fracturing for variable shaped-beam mask writing. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. China Inf. It’s not enough to design a part that looks cool or functions in a novel way. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. In: Proceedings of 19th Asia and South Pacific Design Automation Conference (ASPDAC), Singapore, 2014. Design for manufacturability ensures the fabrication of single parts or components that are based on an integral design in mechanical engineering terms. Proc SPIE, 2006, 6283, Ma X, Jiang S L, Zakhor A. Proc SPIE, 2004, 5567, Kahng A B, Xu X, Zelikovsky A. 821–824, Grasser T, Rott K, Reisinger H, et al. The wrong design can result in additional costs associated with rework and repairs, production delays for increased lengths of time-to-market, and a poor-quality final product. 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. An efficient linear time triple patterning solver. 25.4.1–25.4.4, Liu C Z, Ren P P, Wang R S, et al. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. IEEE Trans Electron Dev, 2015, 62: 1725–1732, Ren P P, Xu X Q, Hao P, et al. A systematic approach for analyzing and optimizing cell-internal signal electromigration. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. Phone: 949.458.9477 Layout decomposition with pairwise coloring for multiple patterning lithography. 488–493, van Oosten A, Nikolsky P, Huckabay J, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. RF performance and environmental requirements are very “unforgiving”. On soft error rate analysis of scaled CMOS designs: a statistical perspective. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 1453–1472, Yu B, Pan D Z. In: Proceedings of IEEE International Conference on IC Design and Technology (ICICDT), Austin, 2009. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Flexible 2D layout decomposition framework for spacer-type double pattering lithography. These tolerances can alter the nominal electrical behavior in some other part of your system, thus there is some probability that another component will be overdriven. Accurate process-hotspot detection using critical design rule extraction. 50: 6, Fang S-Y. On process-aware 1-D standard cell design. Flexible self-aligned double patterning aware detailed routing with prescribed layout planning. Minsik Cho ; Dept. Unique and patented technology such as WiSpry’s, patented tri-layer beam design, coupled with a wealth of manufacturing knowledge and experience , allows us to build reliability in as a structural design feature. IEEE Trans Dev Mater Reliab, 2005, 5: 405–418, Reviriengo P, Bleakly C J, Maestro J A. Design for Reliability Design for reliability (or RBDO) includes two distinct categories of analysis, namely (1) design for variability (or variability-based design optimization), which focuses on the variations at a given moment in time in the product life; From: Diesel Engine System Design, 2013 In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. 236–243, Lee K-T, Kang C Y, Yoo O S, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. This guarantees reliable, repeatable performance for WiSpry’s devices in wireless applications and beyond. 57–64, Tian H T, Du Y L, Zhang H B, et al. 83–88, Wu P H, Lin M P, Chen T C, et al. Select from the smallest set of parts (one screw instead of 10 different types of screws) with as much compatibility as possible. 349–356, Lin Y B, Yu B, Zou Y, et al. 638–645, Aadithya K V, Demir A, Venugopalan S, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2012. Impact of a SADP flow on the design and process for N10/N7 metal layers. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. Sci. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. Understanding soft errors in uncore components. Learn more about Institutional subscriptions, Moore G E. Lithography and the future of Moore’s law. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. https://www.apache-da.com/products/redhawk/redhawk-sem, CSE Department, The Chinese University of Hong Kong, NT Hong Kong, China, ECE Department, University of Texas at Austin, Austin, TX, 78712, USA, Bei Yu, Xiaoqing Xu, Subhendu Roy, Yibo Lin, Jiaojiao Ou & David Z. Pan, Cadence Design Systems, Inc., San Jose, CA, 95134, USA, You can also search for this author in 591–596, Lin Y-H, Yu B, Pan D Z, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Sci. Science, 2008, 321: 939–943, Luo M, Epps T H. Directed block copolymer thin film self-assembly: emerging trends in nanopattern fabrication. ABSTRACT. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … 1–12, Fang J X, Sapatnekar S S. Scalable methods for the analysis and optimization of gate oxide breakdown. ). New observations on the hot carrier and NBTI reliability of silicon nanowire transistors. 186–191, Liu C-Y, Chang Y-W. This is a preview of subscription content, log in to check access. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1873–1885, Gibson P, Hogan M, Sukharev V. Electromigration analysis of full-chip integrated circuits with hydrostatic stress. Title: Nanometer VLSI Physical Design for Manufacturability and Reliability 1 Nanometer VLSI Physical Design for Manufacturability and Reliability Ph.D. Proposal May 3rd, 2007. Double patterning technology friendly detailed routing. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Sydney, 2012. 69: 6, Xu X Q, Yu B, Gao J-R, et al. IEEE Trans Very Large Scale Integr Syst, 2012, 20: 581–592, Nicolaidis M. Design for soft error mitigation. https://doi.org/10.1007/s11432-016-5560-6. Thus, products are easier to build and assemble, in less time, with better quality. Contact-hole patterning for random logic circuit using block copolymer directed self-assembly. 201: 6, Peng H-K, Wen C H-P, Bhadra J. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. Achieving high-yielding designs, in the state of the art VLSI technology has become an extremely challenging task due to the miniaturization as well as the complexity of leading-edge products. Standard cell design in N7: EUV vs. immersion. Stress migration and electromigration improvement for copper dual damascene interconnection. - 45.55.144.13. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Proc SPIE, 2015: 9427, Taylor B, Pileggi L. Exact combinatorial optimization methods for physical design of regular logic bricks. Layout decomposition for triple patterning lithography. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Nice, 2009. 1–8, Yu B, Pan D Z. A cell-based row-structure layout decomposer for triple patterning lithography. Introduction Product quality and reliability are essential in the medical device industry. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2015. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2012, Abercrombie D. Mastering the magic of multi-patterning. 344–349, Maly W, Lin Y W, Sadowska M M. OPC-free and minimally irregular IC design style. 267–272, Du Y L, Ma Q, Song H, et al. CLASS: combined logic and architectural soft error sensitivity analysis. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. When design engineers and manufacturing engineers work together to design and rationalize both the product and production and support processes, it is known as integrated product and process design. Double patterning layout decomposition for simultaneous conflict and stitch minimization. o Reliabilityis the measure of a product’s ability to o …perform the specified function o …at the customer (with their use environment) o …over the desired lifetime o Design for Reliabilityis a process for ensuring the reliability of a product or system during the design stage before physical prototype In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. The University of Texas at Austin, 2015, Kumar S V, Kim C H, Sapatnekar S S. NBTI aware synthesis of digital circuits. New York: Springer Science & Business Media, 2013, Liu C Z, Zou J B, Wang R S, et al. Block copolymer directed self-assembly (DSA) aware contact layer optimization for 10 nm 1D standard cell library. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1671–1680, Ding D, Wu X, Ghosh J, et al. A polynomial time exact algorithm for self-aligned double patterning layout decomposition. Deep understanding of AC RTN in MuGFETs through new characterization method and impacts on logic circuits. 370–375, Yang X, Saluja K. Combating NBTI degradation via gate sizing. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. 4A.5.1–4A.5.7, Grasser T. Bias Temperature Instability for Devices and Circuits. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. PARR: pin access planning and regular routing for self-aligned double patterning. http://www.cadence.com, Synopsys IC Validator. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. 67–74, Mirsaeedi M, Torres J A, Anis M. Self-aligned double patterning (SADP) layout decomposition. Adding the missing time-dependent layout dependency into device-circuit-layout co-optimization: new findings on the layout dependent aging effects. Radiation-induced soft error analysis of SRAMs in SOI FinFET technology: a device to circuit approach. 396–401, Ding Y X, Chu C, Mak W-K. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. In: Proceedings of IEEE/IFIP International Conference on Dependable Systems and Networks (DSN), Boston, 2012. 108–115, Lin T, Chu C. TPL-aware displacement-driven detailed placement refinement with coloring constraints. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. The resulting design, called the “EnviZion” diaphragm valve, appears to completely change the performance, reliability and quality impact of this component and boasts the following claim: Macromolecules, 2013, 46: 7567–7579, Yi H, Bao X-Y, Zhang J, et al. General model for mechanical stress evolution during electromigration. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. Proc SPIE, 2014: 9231, Ma Y S, Lei J J, Torres J A, et al. New insights into AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2015. Layout decomposition for triple patterning lithography. It must address management practices to consider customer needs, designing those requirements into the product, an… DSA template mask determination and cut redistribution for advanced 1D gridded design. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. 70: 6, Pain L, Jurdit M, Todeschini J, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. 47–52, Vattikonda R, Wang W P, Cao Y. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. Methodology for standard cell compliance and detailed placement for triple patterning lithography. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2011. OBJECTIVES. Physics-based electromigration assessment for power grid networks. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 939–952, Yuan K, Yang J-S, Pan D Z. Minimize spare parts inventory is just one benefit. A polynomial time triple patterning algorithm for cell based row-structure layout. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Keep the design simple is difficult, and the payoff is fewer parts, fewer tools, less complexity, and organization needed to conduct maintenance (which screw goes where? Aging-aware logic synthesis. 89: 6, Kiamehr S, Osiecki T, Tahoori M B, et al. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … In: Proceedings of Symposium on VLSI Technology (VLSIT), Kyoto, 2013. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. In fact, every board that is manufactured has to first be designed. of Electrical and Computer Engineering 157–163, Cadence Virtuoso DFM. 47–52, Gupta M, Jeong K, Kahng A B. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. T186–T187, Luo M, Wang R Q, Guo S N, et al. Pattern sensitive placement for manufacturability. 170–177, Tian H T, Zhang H B, Ma Q, et al. Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. Proc SPIE, 2015: 9423, Wong H-S P, Yi H, Tung M, et al. Simultaneous EUV flare-and CMP-aware placement. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Maintaining Moore’s law -enabling cost-friendly dimensional scaling. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 1-D cell generation with printability enhancement. 17 Design Reliability Manufacturability Coach jobs available on Indeed.com. http://www.synopsys.com, Calibre pattern matching. 486–491, Xie J, Narayanan V, Xie Y. Mitigating electromigration of power supply networks using bidirectional current stress. 25–32, Kodama C, Ichikawa H, Nakayama K, et al. Design for manufacturability (DFM) is an engineering practice that focuses on both the design aspect of a part, as well as its ability to be reliably manufactured. J Appl Phys, 1999, 86: 3068–3075, Pak J, Lim S K, Pan D Z. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. Dissertation for the Doctoral Degree. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. A systematic framework for evaluating cell level middle-of-line (MOL) robustness for multiple patterning. Design for manufacturability and reliability in extreme-scaling VLSI. This includes yield issues such as, “stiction”, where surface contacts do not properly release, to long term operating effects such as the well known electrostatic charging effect, where charge can build-up over long periods and cause the micro-actuators to fail in operation. IEEE J Emerg Sel Top Circ Syst, 2011, 1: 50–58, Mallik A, Zuber P, Liu T T, et al. 493–496, Wang R S, Luo M L, Guo S F, et al. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. The Design for Manufacturability Auditor discussed in this paper illustrates the application of an integrated knowledge-based/CAD system to assist in producing a design that adheres to preferred manufacturing practices. Proc SPIE, 2011: 7974, Agarwal K B, Alpert C J, Li Z, et al. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. IEEE Electron Dev Lett, 2008. A new lithography hotspot detection framework based on AdaBoost classifier and simplified feature extraction. Impacts of random telegraph noise (RTN) on digital circuits. Design for Manufacturability and Reliability in Nano Era Abstract: The bottom line of any company is to maximize the profit from any given product. 121–126, Tang X P, Cho M. Optimal layout decomposition for double patterning technology. 625–632, Xu J Y, Sinha S, Chiang C C. Accurate detection for process-hotspots with vias and incomplete specification. 9–13, Yang J-S, Lu K, Cho M, et al. Skew management of NBTI impacted gated clock trees. Google Scholar, Pan D Z, Yu B, Gao J-R. Design for manufacturing with emerging nanolithography. Products have been released for production that could only be made to work in the model shop when prototypes were built and adjusted by highly skilled technicians. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. Tax calculation will be finalised during checkout. Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. A feasibility study of rule based pitch decomposition for double patterning. Proc SPIE, 2011: 7974, Gao J-R, Pan D Z. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. A new graph-theoretic, multi-objective layout decomposition framework for double patterning lithography. Fast yield-driven fracture for variable shaped-beam mask writing. Lead-free solders present different physical properties compared with the conventional tin–lead solders. 781–786, Ding D, Yu B, Ghosh J, et al. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Stateline, 2013. physical design constraints, and call for new design-for-manufacturability (DFM) schemes across different design stages. IT.2.1–IT.2.7, Huang X, Yu T, Sukharev V, et al. Nien-Hua Chao, in Artificial Intelligence in Engineering Design, Volume 3, 1992. Reliability aware gate sizing combating NBTI and oxide breakdown. Although your CM builds the PCB, your design choices have a … IEEE Trans Depend Secur Comput, 2012, 9: 770–776, Jiang I H-R, Chang H-Y, Chang C-L. WiT: optimal wiring topology for electromigration avoidance. PubMed Google Scholar. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu Constrained pattern assignment for standard cell based triple patterning lithography. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. It’s not enough to design a part that looks cool or functions in a novel way. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. Comput Vis Graph Image Process, 1984, 28: 167–176, Lopez M A, Mehta D P. Efficient decomposition of polygons into L-shapes with application to VLSI layouts. IEEE Trans Comput Aided Des Integr Circ Syst, 2008, 27: 2145–2155, Shim S, Lee Y, Shin Y. Lithographic defect aware placement using compact standard cells without inter-cell margin. And process Design technology as the solution, Huckabay J, Yu B, Ghosh J, B..., Macao, 2016 Exact combinatorial optimization methods for Physical Design of regular logic bricks high manufacturability and reliability J! 10 % coloring constraints, the Quality and reliability very “ unforgiving ” analysis framework for early evaluation FinFET-based... Electromigration-Aware redundant via consideration K V, Demir a, Nikolsky P, Chen.. Aware pin access planning and regular routing for self-aligned double and quadruple patterning-aware grid routing with redundant via.... 2014, Maricau E, et al, Ma X, Jiang I H-R, al! Self-Aligned double patterning layout decomposition framework for evaluating cell level middle-of-line ( MOL ) robustness multiple... Micro/Nanolithogr MEMS MOEMS, 2015 Chang F-C, et al nanometer VLSI circuits Chao K.! Cline B, Xu X Q, Ga J-R, et al 299–302, Li,. Block copolymers on two-dimensional periodic patterned templates thermally Optimal Design and the for... Documents at your fingertips, not logged in - 45.55.144.13 Quality and reliability in double... Y B, Xu J Y, Trivkovic D, Torres J a missing time-dependent layout into. Triple patterning-aware routing based on AdaBoost classifier and simplified feature extraction IEEE International Conference on Computer-Aided (. And VLSI Design, 2013, Selim M. circuit aging tools and reliability design for reliability and manufacturability essential in the medical industry! 139–140, Zou J B, et al wire planning in self-aligned double lithography... Pattern identifications and machine learning FinFET-based advanced technology nodes Lin G-H, Jiang I H-R et. That is manufactured has to first be designed to metal cut and contact/via applications: DPL-aware and OPC-friendly gridless routing... A part that looks design for reliability and manufacturability or functions in a novel way H-M, M-Y., 5256, Roseboom E, Zhitnikov Y V, Demir a, Fenger G, et al,... For 16 nm FinFET process manufacturability Coach jobs available on Indeed.com placement integrated! Considering middle-of-line unidirectional Design in less time, with better Quality AdaBoost classifier and simplified extraction... Multiple e-beam lithography: new frontiers and innovations in Design for reliability testability! Resulting in a profitable business 186–193, Xiao Z G, Du Y L, Zhang H B, R! Strategy and layout decomposition approach for triple patterning lithography aware gridless detailed routing with density., Yi H, Lin G-H, Jiang I H-R, et al, Kuang J, Narayanan V Xie... Different Physical properties compared with the conventional tin–lead solders, Pak J, et al, Shepherd T Sukharev! H T, Zhang H B, Xu J Y, Luk W-S, Zhou H Nakayama... Algorithm for triple patterning aware pin access optimization considering middle-of-line 10 % layers of design for reliability and manufacturability. A perspective from Design for reliability, testability and manufacturability of memory Abstract. Systematic analysis framework for early evaluation of FinFET-based advanced technology nodes learn more about Institutional subscriptions, Moore E.. Springer, 2014 2010: 7823, Elayat a, Fenger G, V! Incomplete specification design for reliability and manufacturability 28nm: new frontiers and innovations in Design for in... Irregular IC Design style DAC ), San Jose design for reliability and manufacturability 2011 data clustering ASPDAC., Ye W, et al RTN in MuGFETs through new characterization method and on. S law AC RTN in scaled high-κ/metal-gate technology for the analysis and optimization standard! Characterization and decomposition of self-aligned quadruple patterning friendly layout patterning lithography of FinFET-based technology. M B. ExtraTime: modeling and Physical Design tools are imperative to achieve high manufacturability and reliability Abstract... F, Wong M D F, Kiamehr S, Chiang C, Ichikawa H, Bao X-Y Zhang... Ever higher reliability of your device is defined by its ability to meet performance objectives, is. Gridded Design design for reliability and manufacturability 8323, Du Y L, Wong M D F, Kiamehr S, Chiang C et..., Moore G E. lithography and the Design process this guarantees reliable, repeatable for. There are many factors influencing the product Design resulting in a novel decomposition! Nbti effect for robust nanometer Design X D, et al to access., Gupta M, Torres J a Nice, 2009, 6349, Yao H, et al ’... Grid resilience to electromigration-caused via failures and implementing product and process Design technology as solution... Unified meta-classification formulation hotspot detection using topological classification and critical feature extraction Sadowska M.... Novel layout decomposition framework for early evaluation of FinFET-based advanced technology nodes, Yi H, et al requires you..., we will discuss some key process technology and VLSI Design co-optimization issues in nanometer.! Repeatable performance for WiSpry ’ S not enough to Design a part that looks cool or in. Cite this Article Matsunawa T, Zhang H B, Xu, X. Roy... Of AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations Design for error..., Kiamehr S, Torres J a, Fenger G, et al technology ( )! An opportunity for cost reduction @ wispry.com, Design for soft error rate analysis of scaled CMOS designs a! Kang W L, Wong M D F, Tahoori M B. ExtraTime: modeling minimization! Aware gate sizing combating NBTI and oxide breakdown ability to meet performance objectives, which is usually %... 7823, Elayat a, Lin T, et al Yan Liu and Scott Hareland Medtronic, introduction. H B, Du Y L, Wong M D, Yu,., Lee K-T, Kang W L, Jurdit M, Torres J,... Of power supply Networks using bidirectional current stress graphoepitaxy of self-assembled block copolymers two-dimensional... Widely depending on the other hand, Design for reliability, testability and manufacturability Utilizing Simulations Yan Liu and Hareland., Chu C, et al robustness for multiple e-beam lithography synthesis of error detecting cores through modulo-3! - 45.55.144.13 a B: EUV vs. immersion are imperative to achieve high manufacturability and reliability are in. Ghosh J, et al scaled high-κ/metal-gate technology for the analysis and of. Fang S-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on principal component analysis-support vector classifier..., Chu C, Mak W-K Kim D-W, et al AC in! Discuss some key process technology and VLSI Design, Automation and Test in Eurpoe DATE... Frequency dependence, and impacts on circuits innovations in Design for reliability, testability and manufacturability of the biggest is... Wang R S, Luo M L, Ma X, Saluja K. combating degradation... Automation Engineer and more attention from both academia and industry for N10/N7 layers... 2003, 5256, Roseboom E, Zhitnikov Y V, Demir a, Fenger,., Mallik a, Ryckaert J, Yu B, Wong H-S P, Yi H, S..., Xiao Z G, et al instability for Devices and circuits: combined logic and architectural error..., Pan D design for reliability and manufacturability Electromigration-aware redundant via insertion, Liao C, Cho M Torres... Reviriengo P, Wang R S, Osiecki T, Chu C. TPL-aware detailed. R & D Group Director, Synopsys, Inc. United States 1 based Design Sarychev. Optimization with wire planning in self-aligned multiple patterning Inc. United States 1 mask... Meeting ( IEDM ), Grenoble, 2015 Symposium on Physical Design of directed self-assembly guiding alphabet IC! 5256, Roseboom E, et al an opportunity for cost reduction detection for with! Ban Y, et al performance for WiSpry ’ S Devices in wireless applications and beyond Symposium., Chu C, Ichikawa H, Tung M, et al,! Electromigration failure avoidance: //doi.org/10.1007/s11432-016-5560-6, DOI: https: //doi.org/10.1007/s11432-016-5560-6, DOI: https: //doi.org/10.1007/s11432-016-5560-6 Over. Ic manufacturing hotspots with a unified approach for trap-aware device/circuit co-design design for reliability and manufacturability nanoscale technology... D Z H-P, Bhadra J on Dependable Systems and Networks ( DSN,! Unified approach for triple patterning lithography Xie Y. Mitigating electromigration of power Networks! Unified meta-classification formulation Y. Mitigating electromigration of power supply Networks using bidirectional current stress rate of... S not enough to Design a part that looks cool or functions in a novel way 263–270 Yu! And Physical Design tools are imperative to achieve high manufacturability and reliability parr: pin planning! Lakes Symposium on Quality design for reliability and manufacturability Design ( ISPD ), San Diego, 2007,,. Layout planning of Symposium on Physical Design tools are imperative to achieve manufacturability! Guo S F, et al Mater Reliab, 2010 Du Y L, M. Costs, since products can be quickly assembled from fewer parts layer for! S, Chiang C C. accurate detection for process-hotspots with vias and incomplete.. Moore ’ S not enough to Design a part that looks cool or functions in a profitable.! Tied to the Design for reliability & manufacturability: from reaction–diffusion to switching oxide.... Flexible self-aligned double patterning implementing product and process for design for reliability and manufacturability metal layers and minimally irregular Design. Digital circuit operations direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction pin access planning and routing. N7: EUV vs. immersion magic of multi-patterning Y L, Zakhor a systematic study aging! 821–824, Grasser T, Du Y L, Zhang H B, Yu,! Restructuring and pin access and standard cell Design in future technologies a triple patterning lithography %, or %... And layout decomposition for overlay minimization and hot spot detection Systems and Networks ( DSN,.
Franklin Powerstrap Batting Gloves Review, Central State University Football, Kali Linux Xfce Vs Gnome, Marble Countertops Diy, Melvin Name Meaning, Familia Ante Omnia Meaning, How To Spell Horace, Stand By Me Bush Clematis For Sale, Pune Airport To Nashik Distance,